MECHANICAL SPECIFICATIONS

Indium Antimonide (InSb) can be supplied as wafers with as-cut, etched or polished finishes and are available in a wide range of carrier concentration, diameter and thickness.

PACKAGING

Polished Wafers

Wafers are packaged in coin-style wafer carriers that are individually sealed in two outer bags under inert atmosphere.

As-cut Wafers

Packaged in coin-style wafer carriers, Gel-Pak or glassine bag.

Mechanical Wafers

Packaged in coin-style wafer carriers individually sealed in one outer bag.

Other forms of packaging are available upon request. Please contact us to discuss your requirements.

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